激光精确微加工(英文影印版) pdf epub mobi txt 电子书 下载 2024

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激光精确微加工(英文影印版)

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[日] 杉冈幸次(K. Sugioka),[加拿大] 梅乌涅尔(M.Meunier),[美] 皮凯(A.Pipue) 编



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发表于2024-12-22

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出版社: 北京大学出版社
ISBN:9787301248287
版次:1
商品编码:11580798
包装:平装
丛书名: 中外物理学精品书系
开本:16开
出版时间:2014-10-01
用纸:胶版纸
页数:364

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激光精确微加工(英文影印版) epub 下载 mobi 下载 pdf 下载 txt 电子书 下载 2024

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具体描述

编辑推荐

  激光能量高度集中,而且便于操控,能够进行精细加工。正因为这样,激光加工技术的应用非常迅猛,已经形成了庞大的产业。同时,激光精确加工的技术本身也在蓬勃发展。作为详细讲述这一领域诸多方面的专著,《激光精确微加工(英文影印版)》对于国内相关领域的工程师和科学家,以及研究生来说都是不可多得的佳作。

内容简介

  小型化和高精度快速成为对很多工艺流程和产品的要求。因此,利用激光微加工技术来实现这一要求得到了广泛关注。《激光精确微加工(英文影印版)》内容有16章,覆盖了激光微处理技术的各个方面,从基本概念到在无机或生物材料上的工程应用。《激光精确微加工(英文影印版)》综述了在激光处理领域的研究和技术发展水平。读者对象为本领域的研究者和研究生。

作者简介

  杉冈幸次(K. Sugioka),日本理化学研究所(RIKEN)研究员。

目录

Process Control in Laser Material Processing
for the Micro and Nanometer Scale Domains
Henry Helvajian
1.1 Introduction
1.2 Laser Processing
1.2.1 Laser Wavelength
1.2.2 Laser Power
1.2.3 Laser Dose
1.2.4 Laser Beam
1.2.5 Laser Pulse Temporal Profile
1.2.6 Pattern Generation
1.3 Possible Steps Forward
1.4 Conclusions
References
Theory and Simulation of Laser Ablation — from Basic
Mechanisms to Applications
Laurent J. Lewis and Danny Perez
2.1 Introduction
2.2 Basic Physics
2.2.1 Light—Matter Interaction
2.2.2 Material Removal from the Target:
The Basics of Ablation
2.3 Ablation in the Thermal Regime
2.3.1 Thermodynamics
2.3.2 Conventional Wisdom: Early Theories
2.3.3 A New Understanding
2.3.4 Computer Models
2.3.5 The Femtosecond Regime
2.3.6 Picosecond Pulses and Beyond
2.3.7 Molecular Solids
2.4 Materials Processing
2.4.1 Nanoparticle Production in Solvents
2.4.2 Damages and Heat Affected Zones
2.5 Conclusions and Perspectives
References
Laser Devices and Optical Systems for Laser Precision
Micro fabrication
4 Fundamentals of Laser—Material Interaction and Application to Multiscale Surface Modification
5 Temporal Pulse Tailoring in Ultrafast Laser Manufacturing Technologies
6 Laser Nanosurgery, Manipulation, and Transportationof Cells and Tissues
7 Laser Synthesis of Nanomaterials
8 UItrafast Laser Micro— and Nanostructuring
9 3D Fabrication of Embedded Microcomponents
10 Micromachining and Patterning
11 Laser Transfer Techniques for Digital Microfabrication
12 Hybrid Laser Processing of Transparent Materials
13 Drilling, Cutting, Welding, Marking and Microforming
Index

精彩书摘

  《激光精确微加工(英文影印版)》:
  A number of laser processing research studies have pointed to the use of morepulses and lower fluences. Consequently, this has generated interest on exploringthe effects of tailored photon fluxes on materials processing. How might a desiredphoton flux be expressed for an application? One approach could be in the form ofprescribed information scripts in which relevant processing parameters are definedand can be implemented by appropriate light valve devices on demand [64]. For thesystem to operate efficiently, the light valves must be integrated with in situ feedbackfrom the photophysical event. This is likely to come via spectroscopic signaturesthat are sensed and analyzed for deciding the next course of action. The practicalquestion is whether a photon flux control system, such as described, could be realized when operating at near real time processing speeds. The analysis is easier to dofor a direct-write patterning tool. Assume a processing laser with 50 MHz repetitionrate (pulses separated by 20 ns) that is brought to a 1 um (dia) focus on a target.Assume also that the patterning tool can move at a hefty speed of 1 m/sec (e.g.,Aerotech Corp. ABLS000 air bearing stage) which means that the patterning toolcan service 106 spot-sizes/sec. At the maximum velocity, the average time the patterning tool spends over a single spot-size is 1 us. There are now optical sensors withsubnanosecond response times and typical electrical signal transfer times in common cabling run about 3 ns/m. Microprocessor speeds have significantly evolved inthe past 15 years with the 2007 PC CPU tests showing the Intel CORE 2 ExtremeQX6800 processor capable of over 37 GFLOPS (Giga FLoating point OperationsPer Second). Finally, in the early 1990s, there was literature on acousto-optic modulators (e.g., Ti:LiNbO3) with bandwidths near 20 GHz [70] and current analog todigital convertors (ADCs) can operate up to 2 G samples per sec (e.g., Delphi Engineering ADC3244: 2GSPS, 10 bit accuracy and an integral field programmable gatearray). Given this information and the fact that for this example the average durationof time spent over a single spot-size is 1 us, it becomes possible to assemble a control system whereby information from a sensor is analyzed by the microprocessor(e.g., for GO/NO-GO or via a complex decision tree), and this information is sentto a light switch which either adds or subtracts extra laser pulses accordingly.
  ……

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